摘要
在微波组件中,有源器件是主要热源,它们对微波组件的热性能具有决定性的作用。基于ANSYS有限元分析软件,采用有限元分析法,针对某型号微波组件用pin梁式引线管热元模型进行了模拟和分析。模拟结果与实际样品的红外热像测试结果基本一致,表明热元模型正确地反映了pin管在组件中的热性能状况情况。热元模型的建立能快速、简便地获得组件中单个管芯的温度分布情况,可缩短热设计与测试周期。
The active devices are the main heat sources in microwave modules and determines their thermal performance. A beam lead PIN diode for a microwave module was simulated and analyzed with the ANSYS-based finite element software. The simulated results were basically agreed with the thermal imaging test of the real samples, which implied that the thermal element model correctly reflected the thermal performace of the PIN diode in the module. Using the thermal element model, the temperature distribution of a specific die in a module can be easily and quickly obtained to reduce the thermal design and test cycle.
出处
《电子产品可靠性与环境试验》
2009年第1期43-47,共5页
Electronic Product Reliability and Environmental Testing
关键词
微波组件
热分析
有限元
结温
microwave module
thermal analysis
FEA
junction temperature
