摘要
以氨水、醋酸为催化剂,用正硅酸已酯(TEOS)为Si源,甘油作为防裂剂,聚乙烯醇(PVA1750)作为致缓剂和发泡剂,制作多孔SiO2薄膜。碱催化使得硅-羟基化合物的溶解度增大,并抑制了SiO2的聚合,弱酸的二步催化使硅-羟基化合物聚合成10～100nm的胶粒。丙三醇和TEOS水解的中间体Si(OC2H5)4-x(OH)x硅羟基形成氢键,抑制了硅-羟基化合物的聚沉,PVA的存在减缓了溶胶的聚合,在快速退火炉热处理时产生多孔结构。多孔SiO的厚度在3μm内可调。
Taking ammonia, acetic acid as catalyzer, TEOS as Si sources, glycerin as anti-cracking agent, PVA1750 as ingredients and foaming agent, porous silica film was fabricated. Alkli catalyzer makes the silicon-hydroxyl compound solubility increase, and restrain silica agregation, acid catalyzer makes the silicon-hydroxyl agregate to grain of 10-100 nm. Gylcerol and TEOS intermediate Si （0C2H5）4-x （OH）x compose hydrogen bond, and restrain silicon-hydroxyl compound sedimentation. PVA decrease sol＇s agregation makes porous structure in the thermal process. The porous silica film thickness is about 3 um.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第3期225-227,共3页
Semiconductor Technology
基金
国家自然科学基金(10675055)
常州市科技计划资金资助项目(CE:2005027)
