期刊文献+

引线键合劈刀Z轴运动信号分析

Z-Axis Movement Signal Analysis of Capillary for Wire Bonding
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摘要 劈刀是自动引线键合机的关键部件之一,采集和分析劈刀的运动信号对于研究和改进微电子封装设备的制造工艺技术具有重要意义。利用激光多普勒(Doppler)非接触式测量方法,通过有效的试验光路设计,提取劈刀在实际键合过程中的Z轴运动信号;对试验采集信号进行了详细的时域分析,包括位移、速度、加速度分析,结果表明,以上研究清楚地描述了键合过程中劈刀Z轴运动的动态变化特性;最后,针对劈刀下落过程的搜索区域阶段(tip-offset)的运动干扰现象分析了其原因。 Capillary is the key component of the automatic wire bonder, the collection and analysis of the capillary movement signal have important significance on the improving and studying of the microelectronics equipment manufacture and techniques. Through laser Doppler non-contact test method and effective optical design, the Z-axis movement signal of capillary was acquired from the actual thermosonic bonding. A detailed acceleration analysis time domain analysis on the test signal was done, including displacement, velocity and A clear description of the dynamic changes of capillary Z-axis movement during the bonding process was achieved. Finally, the phenomenon of velocity instability under the search level (tipoffset) was analyzed.
出处 《半导体技术》 CAS CSCD 北大核心 2009年第3期266-269,共4页 Semiconductor Technology
基金 广东省科技攻关项目(2005A10403004 2006A10401003)
关键词 引线键合 劈刀 键合速度 非接触式测量 运动干扰 wire bonding capillary bonding velocity non-contact test movement disturbance
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参考文献10

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