摘要
本文针对一种陶瓷粉填充、玻璃短纤维增强的聚四氟乙烯高频介质材料，制造通讯用多层微波印制电路板进行了简单的介绍，此外，选用ARLON公司生产的25FR半固化片材料，进行微波多层印制板层压制造的工艺技术进行了较为详细的介绍。
The fabrication of the microwave multilayer printed circuit board of the glass microfiber reinforced polytetrafluoetylene with ceramic particles filled composite applied for communication was briefly introduced, Besides, the press technology of the microwave multilayer printed circuit board using 25FR prepreg from ARLON was detailed introduced.
出处
《电子电路与贴装》
2009年第1期39-43,共5页
Electronics Circuit & SMT
关键词
微波
多层印制板
层压
Microwave , Multilayer printed circuit board, Press
