转换阵列式碳纳米管薄膜至铝箔上的工艺

Re-assembly of Aligned Array Carbon Nanotubes on an Aluminum Foil Substrates

描述了一种将阵列式碳纳米管(CNTs)膜从石英基底转移至新基底(铝箔)上的工艺。用SEM检测了转移至铝箔上后各层膜的形貌并测试了铝箔CNTs膜的电阻。结果表明转基底工艺可以显著提高CNTs薄膜的利用率。去除90%不干胶后铝基CNTs薄膜的电阻可以达到0.3Ω以下。

A novel technology for aligned array carbon nanotubes（CNTs） films reassembled on metal foils is explored. By the technology, CNTs deposited on quartz wafer at high temperature can be transferred on aluminum foils with sticky glue layer by layer. The morphologies and electrical conductance properties of the CNTs reassembled are investigated and characterized via SEM and electrical resistance detection. The results show that the technology can be well used to transfer CNTs to any metal foil with stick glue, perfectly keeping shape of the CNTs in the original CNTs films. The electrical resistance between the CNTs films and metal foils can be adjusted through gas vaporizing post treatment of stick glue. The smallest electrical resistance achieved of the CNTs with metal foil substrates is less than 0.3Ω