摘要
光互连是突破传统微电子IC性能瓶颈的重要技术手段,对推进"后摩尔时代"微电子技术的发展和高性能计算技术的实现具有关键性意义。本文在归纳总结不同层次光互连结构特点的基础上,对片上光互连(on-chip or intra-chip optical interconnects)所涉及的若干种无源光子集成器件的设计制备及性能特点进行了分析介绍,这些器件包括SOI亚波长光子线波导、SOI光子晶体波导、MMI分束/合束器、微环/微盘谐振腔滤波器、光子晶体微腔耦合滤波器、光子晶体反射镜等,是硅基片上光互连的基本构成单元。本文对这些关键性光子集成器件的国内最新研究进展进行了报道。
Optical interconnects is an important measure to break through the performance "bottleneck" of the traditional microelectronics IC chips. Several important passive photonic integrated devices for on-chip optical interconnects were introduced and analyzed in terms of their design, fabrication, and characteristics. Specifically, these building blocks for optical interconnects include SOI based sub-wavelength photonic wires, photonic crystal waveguides, MMI beam splitter/ combiner, micro ring/disk resonator, photonic crystal micro cavity filter, and photonic crystal corner reflector, and their recent domestic research progresses were presented.
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2009年第1期153-156,149,共5页
Journal of Materials Science and Engineering
基金
国家自然科学基金资助项目(60577044)
“863计划”资助项目(2006AA032424)
“973计划”资助项目(2007CB613405)