直接扩散连接制备多芯Bi系超导带材超导接头

Superconducting joint with multifilamentary superconducting BSCCO tapes by diffusion bonding

采用扩散连接方法对61芯Bi系高温超导带材(BSCCO)进行连接,研究了连接温度、保温时间、连接压力对接头超导电性的影响规律,并对超导接头的组织进行了微观分析.结果表明,连接温度对接头的超导性能影响较大,保温时间和连接压力在一定的范围内,对接头的超导性能影响不大;当连接温度为820℃,保温时间120min,连接压力3MPa时,接头获得最佳的超导电性能,接头的超导性能达到了原始母材的65.9%.微观分析表明,接头界面区域组织致密,主要由Bi-2223相和少量的Bi-2212相构成.

Diffusion bonding of 61-filament high-temperature superconducting tapes has been carried out.The effects of bonding temperature,holding time and bonding pressure on the superconducting properties of the joints were studied.And the microstructures of the joint were examined.The result shows that bonding temperature has a great influence on the superconducting property of the joint,and the effects of holding time and bonding pressure are limited in a certain range.The optimum joints are obtained under the parameters of 820 ℃,120 min and 3 MPa,which reach 65.9% superconducting property of the original superconducting tapes.Microstructures of the joint show that the interface is compact structure and composed of Bi-2223 phase and a small amount of Bi-2212 phase.