3D IC集成与硅通孔(TSV)互连

3D IC Stacking with TSV Interconnect

介绍了3维封装及其互连技术的研究与开发现状,重点讨论了垂直互连的硅通孔(TSV)互连工艺的关键技术及其加工设备面临的挑战,提出了工艺和设备开发商的应对措施并探讨了3DTSV封装技术的应用前景。

The status quo of both research work and its development of 3D package and interconnect technique is reviewed in this paper, and with focus on the key technique of perpendicularity interconnected silicon through hole （TSV） technology and the facing challenges of its processes equipment. At the end, bring forward the response measures for technology and equipment venders and explore the application perspective of 3D TSV package technique.