公司与新品介绍

EV Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and other Advanced Semiconductor, MEMS and Nanotechnology Device Manufacturing--The ＂NT＂ Series Significantly Increases Both Alignment and Mea- surement Accuracy to Enable Better Device Performance and Lower Manufacturing Costs

安森美半导体针对数字及混合信号ASIC推出具价格竞争力的0.18μm CMOS制造工艺全球领先的高性能、高能效硅方案供应商安森美半导体为扩展定制晶圆代工能力。

SHANGHAI, CHINA / ST. FLOR/AN, AUS- TRIA, March 17, 2009 - EV Group （EVG）, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduces the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer （W2W） bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities,