激光微孔加工技术在刚挠性基材中的研究

Research on Laser Micro Via Processing in Rigid and Flexible Substrate Materials

刚挠结合印制板向高密度互联方向发展,要求线路更细,导通孔直径更小。适合刚挠结合印制板的微导通孔加工工艺在刚挠结合印制板制造工艺中起着关键作用,微孔加工工艺中普遍采用激光技术。文章分析了激光微孔加工中的各影响因素,用正交试验法作对比试验,优化各因素参数,讨论了各因素与基板材料的关系,并拟合出方程定量描述此种关系。根据优化方程选取激光微孔参数,在挠性与刚性基板材料上取得理想效果。

The trend towar.ds high-density interconnection（HDI） of rigid-flex board requires more fine lines and smaller diameter of plating through holes.Micro vias processing technology adapted to rigid-flex board plays a key role in rigid-flex board manufacturing process.Laser technology is commonly used in micro vias processing technology. Various factors of laser micro vias processing were analyzed in this paper, and parameters of various factors were optimized utilizing orthogonal experiments to do contradistinctive experiments.The relationship between the various factors and the substrate materials was quantificationally described by fitted equations.Parameters of laser micro vias processing were selected according to optimum equation,and perfect effect was obtained in both rigid and flexible substrate materials.