摘要
在以甲基磺酸锡为主盐、硫脲为电位调整剂的镀液体系中,在铜箔上制备了呈缎面光泽的均匀锡镀层。镀覆过程,用电偶电流法进行了分析;对所得镀层的显微组织结构,采用FE-SEM和XRD进行研究。结果表明,在该镀液体系中浸镀锡,镀覆过程迅速而平稳,所得锡镀层具有体心四方的晶体结构,镀层显微形貌为均匀分布的颗粒状形态。
Stannous methanesulfonate was used as main salt with thiourea as potential regulator in the electroplate bath system. A homogeneous satin-shining tin coating was plated on the copper foil. The tinning course was analyzed with electric couple-electric current process. The microstructure of tin coating was studied with FE-SEM and XRD. The results indicate that the immersion tinning is fast and uniform with tin coating of BCC lattice and well-distributed nanometer particles.
出处
《福建工程学院学报》
CAS
2009年第1期64-66,共3页
Journal of Fujian University of Technology
基金
福建省科技厅资助省属高校项目(2007F5003)
关键词
甲基磺酸锡
铜
缎面处理
锡镀层
显微结构
stannous methane sulfonate
copper
satin finishing
tin coating
microstmcture
