摘要
采用碱性纳米SiO2浆料对计算机硬盘NiP基板进行CMP超精密加工，与酸性浆料对比，在平整度PV、均匀度rms和粗糙度RA均获得显著提高。
NiP substrate of computer hard drive was chemical mechanical Polished by alkali Nanometer SiO2 Slurry. Compared with acid slurry, the Smoothness, the uniformity and the roughness of the NiP treated substrate were improved.
基金
国家自然科学基金（No.10676008）,天津自然科学基金（No.043801211）.教育部博士教育基金（No.20050080007）
关键词
硬盘基板
CMP
碱性浆料
粗糙度
平整度
hard-disk Substrate
CMP
alkali slurry
roughness
planarization
