Ag-Cu-Sn复合电子支架功能材料

Ag-Cu-Sn Compound Electronic Support Material

通过电刷镀方法在铜带基体上获得钝银和纯锡镀层,从而得到一种新型Ag-Cu-Sn复合电子支架功能材料。采用SEM和EDS方法研究了该功能材料的组织结构和成分,测量了其硬度和厚度,并利用弯曲法和划痕实验法检验了其结合强度和抗剥离性能。结果表明,该功能材料可完全满足作为电子支架材料的要求。

The pure silver and the pure tin coating on the copper strip was produced by electronic brush-plating, which a new Cu-Ag-Sn composite functional material for electronic support was obtained. The microstructure and component of the functional materials were examined by SEM and EDS. The hardness and thickness of the coating were tested. The bonding strength between the substrate and coating was also studied. The results show that it can be used as electronic support.