ECR-PECVD制备Si_3N_4硬质陶瓷薄膜的研究

Investigation on Silicon Nitride Hard Ceramic Thin Film Prepared by ECRPECVD

采用电子回旋共振等离子体化学气相沉积（ＥＣＲ－ＰＥＣＶＤ）技术制备了Ｓｉ３Ｎ４薄膜。利用显微硬度计测定了Ｓｉ３Ｎ４薄膜的表面微硬度。由摩擦测试机对Ｓｉ３Ｎ４薄膜的摩擦性能进行了测试分析。结果表明，Ｓｉ３Ｎ４薄膜的摩擦系数和单位时间的磨损量较小，该膜具有良好的耐磨性和耐划伤能力。

The Si3N4 thin film has been prepared by the electron cyclotron resonance microwave plasma enhanced chemical vapour deposition (ECRPECVD). The surface microhardness of Si3N4 thin film has been measured with the microhardness meter. The friction property of Si3N4 thin film has been measured with the friction measure machine. The results indicate that the friction coefficient and abrasion magnitude of the unit time are small. This kind of Si3N4 thin film has good antiwear property.