摘要
采用热重分析、差热分析和扫描电镜,研究多层片式压敏电阻的微观结构,分析了有机物、温度对其微观结构形成的影响。建议排胶温度在200～400℃之间,升温速度应缓慢,保证水、溶剂、分散剂、粘合剂等有机物的挥发,避免产生碳。另外,在烧结温度曲线设计上将800℃的保温时间延长,使CO2充分排出。烧结最高温度不能高于内电极金属的熔点,以免造成温度过高使内电极金属扩散到晶界中间,最高温度一般应低于内电极金属熔点40～80℃。且保温时间一般不要超过2 h。
The microstrueture of multi-layer varistor was determined using thermogravimetry（TG）, differential thermal analysis （DTA） and scanning electron microscopy （SEM） and impact of organic additives and temperature on body texture was studied. It recommended that the temperature for binder removing being within 200-400 ℃ with low rising rate for ensuring volatilization of moisture, solvent dispersant and binder, and avoiding from carbon formation, and the maintaining duration at 800 ℃ on sintering graph shall be prolonged for ensuring CO2 releasin. Maximum sintering temperature shall be lower than melting temperature of inner metal electrode over 40-80℃ and maintained less than 2 h for avoiding metal diffusion into partied gaps.
出处
《电瓷避雷器》
CAS
北大核心
2009年第1期39-41,共3页
Insulators and Surge Arresters
关键词
多层片式压敏电阻
微观结构
烧结温度
multi-laminated varistor
microstructure
sintering temperature
