摘要
对于复杂的MCM多层互连基板,电测试是控制成本、确保质量的关键环节。本文简要介绍了探针电阻、电容、电子束、潜在开路缺陷电测试及其测试技术的应用。
Fox complex MCM substrates, electrical test is afundamental element of cost control and quality assurance' This paper presents electrical test of MCM substrates which include: probe resistance. capcitance.electron beam. latent open defects and applications ofthe test technologies.
出处
《微电子学与计算机》
CSCD
北大核心
1998年第3期28-31,共4页
Microelectronics & Computer
关键词
电测试
多层基板
MCM
微模组件
Electrical test, Latent open depects, Thin film.test, Multi-layer substrates, Electron beam