高通量细胞电融合芯片研究进展

Research progress of high-throughput cell electrofusion chip

高通量细胞电融合芯片设计中采用微阵列结构的电极设计方案可提高芯片上微电极的数量,使细胞电融合芯片向高通量、高效率、高集成度的芯片实验室方向发展。通过设计微小尺度的电极间距,降低了对细胞电融合信号高压的要求和融合信号源的制造难度,提高了融合过程的安全性。对微电极形状、融合信号进行优化设计,提高细胞电融合的效率。同时,对芯片制造技术和芯片材料加以优化选择,提高了芯片制造的可靠性和电气与生化等性能。

In the design of high-throughput cell electrofusion chip,microelectrode array mode is used to increase the amount of microelectrodes,which make the cell electrofusion chip develop to high-throughput, high-efficiency and high-integration lab on a chip. Short distance between a pair of electrodes reduces the requirement of electrofusion voltage and hence the manufacture difficulty of signal source, which also improves the security during the fusion process. Micro-electrode shape and fusion signal are optimized to improve the fusion efficiency. Appropriate fabrication technique and material are chosen to improve the reliability of chip, the electric and biochemical performance.