无铅再流焊接PBGA空洞缺陷研究

Research of PBGA Voids in Lead-Free Reflow Process

随着密间距BGA、CSP器件的大量应用,该类器件在焊接中的空洞问题也越来越受到人们的重视。而无铅制程的导入使得这一问题表现得更加突出。基于对多个实际案例的解剖、分析、试验的统计数据基础上,对产品生产过程中所发生的PBGA、CSP的空洞现象进行了分类归纳。并一一研究了其形成机理、影响因素及抑制对策。

With the widely using of fine pitch BGA and CSP, the question of voids in these components was regarded more and more. The lead -free process makes people think this question. Classify the void phenomena, study how to occur the voids, what will effect the voids, and how to restrain the voids. All of these are based on the dissection, analyzing and experiment of many local cases.