摘要
电子元器件的微小型化以及电气互联的无铅化要求,给面向PCA制程的设计带来一系列新挑战。首先对电子元器件小型化和PCB组装无铅化发展的技术趋势进行了分析,从系统设计、元器件选择、PCB设计等角度对板级电路可制造性进行了归纳与总结,最后针对如何正确处理有铅与无铅的兼容性问题提出建议。这些经验与建议可以应用于板级电路的工程设计过程中。
Miniature components and lead free application is essential to the process of PCA. Based on the analysis of miniature components and lead - free assembly, the design principle of system, components selecting and PCB are presented. Finally, proposals of how to handle the assembly including lead and lead free are also given. The principles and proposals can be applied to the design of engineering in PCA.
出处
《电子工艺技术》
2009年第2期82-85,共4页
Electronics Process Technology
