微波电路引线键合质量的影响因素分析

Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit

在一级封装的三种实现电气连接的互连方法中,内引线键合是一种传统的最成熟的技术。其工艺主要分为球焊与楔焊,其中后者由于焊点较小,适用于微波混合电路的组装。从工艺的角度出发,明确了除引线键合参数(超声频率和功率、温度、压力、时间)的设置以外,键合表面与界面的问题对引线键合的质量影响极大,并分别从键合材料的选用、键合表面的状态、键合工具的选型等三方面进行论述。同时结合实际工作,对常见的键合问题与原因分析以及引线键合质量评估的方法进行了说明。

Wire bonding is a traditional method and the most mature technology of the three interconnection methods in the microelectronic assemblies. Its two types of main welding technology are ball bond and wedge bond, and the latter for hybrid microwave circuit assembly due to the smaller spot. From the technology point of view is suitable, the bonding surface and interface problems for wire bonding are believed that have greatly influence on the quality, except the settings of bonding parameters （ultrasonic frequency and power, temperature, pressure, time and so on）. The choice of bonding materials, the surfaces of the bonding, the selection of bonding tools and so on are discussed. Then the reason for the common bonding problems are analysed in the actual work and the assessment methods for the quality of wire bonding are presented.