摘要
再流焊设备与波峰焊设备是自动化电子组装工艺中的主要焊接设备,无铅化工艺对焊接设备提出了许多新的技术要求,相应的对焊接设备的选择也有了新的标准,从无铅化焊接工艺角度出发,分析了两种焊接设备选择中应考虑的问题。
The reflow soldering machine and wave soldering machine are main equipments in auto- matic electronic assembly process and lead -free soldering technology brings many new requires, correspondingly the choice of soldering equipment have some new standards. Analyze the demands for choice of two soldering machines according to lead - free soldering process.
出处
《电子工艺技术》
2009年第2期119-122,共4页
Electronics Process Technology
