电沉积参数对含憎水剂微胶囊复合镀铜层的影响研究

Influence of electrodepositing parameters on composite copper coating with liquid hydrophobic agent microcapsules

采用水相分离法制备出了粒径在2～10μm之间的液体憎水剂微胶囊，研究了含憎水剂微胶囊复合镀铜层的制备工艺，讨论了试样放置方式、电流密度、阴阳极距离、镀液中微胶囊溶液含量、电镀时间等电沉积参数对复合镀铜层中微胶囊含量的影响。研究表明，当试样水平放置时，复合镀铜层中微胶囊的含量明显增加；镀铜层中微胶囊含量随阴极电流密度、阴阳极距离、镀液中微胶囊溶液含量的增加呈现出先增加后减小的趋势；并且随着电沉积时间的增加，复合镀铜层中憎水剂微胶囊的数量增加。

Liquid hydrophobic agent microcapsules in the size range of 2-10μm were prepared by means of separation in water phase in this paper. The preparation process of composite copper coating containing liquid hydrophobic agent microcapsules was studied. Moreover the influence of electrodepositing parameters including sample‘s placing ways, current density, distance between cathode and anode, microcapsule solution’s volume percent and electrodepositing time on liquid microcapsules’ content in composite copper coating were discussed. The results showed that microcapsules＇ content in composite copper coating increased significantly when the samples were placed horizontally. Microcapsules ’ content in copper coating initially increased and then decreased with the increase of current density, distance between cathode and anode and microcapsule solution＇s volume percent. It was also found that liquid hydrophobic agent microcapsules＇ content in composite copper coating increased with electrodepositing time.