纳米AlN/EP导热绝缘胶的制备及其性能研究

Study on preparation and properties of Nano-AlN/EP thermally conductive insulating adhesive

采用纳米AlN作为导热填料,经硅烷偶联剂KH-570表面改性后与环氧树脂(EP)共混制备了导热绝缘胶。通过红外光谱(FT-IR)、接触角方法对改性后纳米AlN进行分析和表征,结果表明,KH-570成功包覆到了纳米AlN表面,粉体由亲水性变为疏水性;对于纳米AlN/EP导热绝缘胶,随着改性纳米AlN填充量的增加,导热率呈上升趋势;当KH-570用量为3.5%、纳米AlN量为20%时,导热率达到0.632W/(m.K),是纯环氧树脂胶的3倍多;此时体积电阻率为2.6×1013Ω.cm,剪切冲击强度为11.9×1015J/m2。

With silicane coupling agent of KH-570 modified nano-AlN as thermal conductive filler,thermally conductive insulating adhesive based on epoxy resin was prepared by means of blending. The modified nano-AlN particles were characterized by FT-IR,contact angle respectively. The results showed that the KH-570 was suc- cessfully grafted to the surface of nano-AlN by the chemical bond, the surface changed from hydrophilicity to hydrophobicity was improved simultaneously. Thermal conductivity of the nano-AlN/EP adhesive increased with the increase of nano-AlN content. When the mass fraction of KH-570 was 3.5 %, simultaneity when the mass fraction of nano-AlN was 20%, the thermal conductivity of the nano-AlN/EP adhesive were up to 0.632W/（m·K） higher 3 times than the pure EP adhesive. Its volume resistance and impact shear strength could reach 2.60×10^13Ω and 11.9× 10^15J/m2 respectively.