期刊文献+

A charge allocating model for the breakdown voltage calculation and optimization of the lateral RESURF devices 被引量:1

A charge allocating model for the breakdown voltage calculation and optimization of the lateral RESURF devices
原文传递
导出
摘要 A new quite simple analytical model based on the charge allocating approach has been proposed to describe the breakdown property of the RESURF (reduced surface field) structure. It agrees well with the results of numerical simulation on predicting the breakdown voltage. Compared with the latest published analytical model, this model has a better accuracy according to the numerical simulation with simpler form. The optimal doping concentration (per unit area) of the epi-layer of the RESURF structures with different structure parameters has been calculated based on this model and the results show no significant discrepancy to the data gained by others. Additionally the physical mechanism of how the surface field is reduced is clearly illustrated by this model. A new quite simple analytical model based on the charge allocating approach has been proposed to describe the breakdown property of the RESURF (reduced surface field) structure. It agrees well with the results of numerical simulation on predicting the breakdown voltage. Compared with the latest published analytical model, this model has a better accuracy according to the numerical simulation with simpler form. The optimal doping concentration (per unit area) of the epi-layer of the RESURF structures with different structure parameters has been calculated based on this model and the results show no significant discrepancy to the data gained by others. Additionally the physical mechanism of how the surface field is reduced is clearly illustrated by this model.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第3期59-62,共4页 半导体学报(英文版)
关键词 RESURF devices analytical model breakdown voltage device optimization RESURF devices analytical model breakdown voltage device optimization
  • 相关文献

参考文献7

  • 1Appels J A, Vaes H M J. High voltage thin layer devices (RESURF devices). IEDM Tech Digest, 1979:238
  • 2Ludikhuize A W. A review of RESURF technology. ISPSD, 2000
  • 3Appels J A, Collet M, Hart P, et al. Thin layer high voltage devices (RESURF devices). Philips J Res, 1980, 35:1
  • 4Vaes H, Appels J. High voltage, high current lateral devices. IEDM Tech Dig, 1980:87
  • 5Iman M, Quddus M, Adams J, et al. Efficacy of charge sharing in reshaping the surface electric field in high-voltage lateral RESURF devices. IEEE Trans Electron Devices, 2004, 51(1): 141
  • 6Wildi E, Gray P, Chow T, et al. Modeling and process of implanted RESURF type devices. IEDM, 1982:268
  • 7Sze S M. Physics of semiconductor devices. New York: Wiley, 1981

同被引文献18

  • 1APPELS J, VAES H, VERHOEVEN J. High voltage thin layer devices [J]: Electron Devices Meeting, 1979, 25: 238-241.
  • 2APPELS J A, COLLET M G, HART P A H, VAES H M J, VERHOEVEN J F C M. Thin layer high voltage devices [J]. Philips Journal of Research, 1980, 35(1): 1-5.
  • 3IMAM M, QUDDUS M, ADAMS J, HOSSAIN Z. Effi- cacy of charge sharing in reshaping the surface elec- tric field in high voltage lateral RESURF devices [J]. IEEE Transactions Electron Devices, 2004, 51(1): 141-148.
  • 4OROUJI A A, MEHRAD M. Breakdown voltage im- provement of LDMOSs by charge balancing: an in- serted P-layer in trench oxide (IPT-LDMOS) [J]. Su- perlattices and Microstructures, 2012, 51: 412-420.
  • 5SHIMAMOTO S, YANAGIDA Y, SHIRAKAWA S, MIYAKOSHI K, OSHIMA T, SAKANO J, WADA S, NOGUCm J. High-performance p-channel LDMOS transistors and wide-range voltage platform technol- ogy using novel p-channel structure [J]. IEEE Trans- actions on Electron Devices, 2013, 60(1): 360-365.
  • 6LI Q, WANG W D, LI H O, WEI X M. High voltage silicon power device structure with substrate bias [J]. Electronics Letters, 2011, 47(25): 1394-1396.
  • 7CHANG Y H, CHANG C H. Improving an LDMOST by variation of lateral doping on epitaxial-layer drift re- gion [J]. Microelectronics Reliability, 2011, 51: 2059- 2063.
  • 8COLAK S. Effects of drift region parameters on the static properties of power LDMOST [J]. IEEE Trans- actions on electron devices, 1981, ED-28(12): 1455- 1465.
  • 9CHUNG S K, HANS Y, SHIN J C, CHUNG S K, HAN S Y, SHIN J C, CHOI Y I, KIM S B. An analyti- cal model for minimum drift region length of SOI RESURF diodes [J]. IEEE Electron Device Letters, 1996, 17(1): 22-24.
  • 10CHUNG S K, HAS S Y. Analytical model for the sur- face field distribution of SOI RESURF devices [J]. IEEE Transactions on Electron Devices, 1998, 45(6): 1374-1376.

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部