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A novel capacitive micro-accelerometer with grid strip capacitances and sensing gap alterable capacitances

A novel capacitive micro-accelerometer with grid strip capacitances and sensing gap alterable capacitances
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摘要 The comb capacitances fabricated by deep reactive ion etching (RIE) process have high aspect ratio which is usually smaller than 30 : 1 for the complicated process factors, and the combs are usually not parallel due to the well-known micro-loading effect and other process factors, which restricts the increase of the seismic mass by increasing the thickness of comb to reduce the thermal mechanical noise and the decrease of the gap of the comb capacitances for increasing the sensitive capacitance to reduce the electrical noise. Aiming at the disadvantage of the deep RIE, a novel capacitive micro-accelerometer with grid strip capacitances and sensing gap alterable capacitances is developed. One part of sensing of inertial signal of the micro-accelerometer is by the grid strip capacitances whose overlapping area is variable and which do not have the non-parallel plate's effect caused by the deep RIE process. Another part is by the sensing gap alterable capacitances whose gap between combs can be reduced by the actuators. The designed initial gap of the alterable comb capacitances is relatively large to depress the effect of the maximum aspect ratio (30 : 1) of deep RIE process. The initial gap of the capacitance of the actuator is smaller than the one of the comb capacitances. The difference between the two gaps is the initial gap of the sensitive capacitor. The designed structure depresses greatly the requirement of deep RIE process. The effects of non-parallel combs on the accelerometer are also analyzed. The characteristics of the micro-accelerometer are discussed by field emission microscopy (FEM) tool ANSYS. The tested devices based on slide-film damping effect are fabricated, and the tested quality factor is 514, which shows that grid strip capacitance design can partly improve the resolution and also prove the feasibility of the designed silicon-glass anodically bonding process. The comb capacitances fabricated by deep reactive ion etching (RIE) process have high aspect ratio which is usually smaller than 30 : 1 for the complicated process factors, and the combs are usually not parallel due to the well-known micro-loading effect and other process factors, which restricts the increase of the seismic mass by increasing the thickness of comb to reduce the thermal mechanical noise and the decrease of the gap of the comb capacitances for increasing the sensitive capacitance to reduce the electrical noise. Aiming at the disadvantage of the deep RIE, a novel capacitive micro-accelerometer with grid strip capacitances and sensing gap alterable capacitances is developed. One part of sensing of inertial signal of the micro-accelerometer is by the grid strip capacitances whose overlapping area is variable and which do not have the non-parallel plate's effect caused by the deep RIE process. Another part is by the sensing gap alterable capacitances whose gap between combs can be reduced by the actuators. The designed initial gap of the alterable comb capacitances is relatively large to depress the effect of the maximum aspect ratio (30 : 1) of deep RIE process. The initial gap of the capacitance of the actuator is smaller than the one of the comb capacitances. The difference between the two gaps is the initial gap of the sensitive capacitor. The designed structure depresses greatly the requirement of deep RIE process. The effects of non-parallel combs on the accelerometer are also analyzed. The characteristics of the micro-accelerometer are discussed by field emission microscopy (FEM) tool ANSYS. The tested devices based on slide-film damping effect are fabricated, and the tested quality factor is 514, which shows that grid strip capacitance design can partly improve the resolution and also prove the feasibility of the designed silicon-glass anodically bonding process.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第3期72-77,共6页 半导体学报(英文版)
基金 supported by the National Natural Science Foundation of China (No. 60506015) the Zhejiang Provincial Natural ScienceFoundation of China (No.Y107105).
关键词 capacitive accelerometer inertial sensor high precision deep RIE capacitive accelerometer inertial sensor high precision deep RIE
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参考文献9

  • 1http://www.colibrys.com/
  • 2Dong Linxi, Che Lufeng, Wang Yuelin. The effect of nonparallel combs of the capacitive micro-sensor on the reliable operation range. Chinese Journal of Semiconductors, 2005, 26(2): 373
  • 3Gabrielson T B. Mechanical-thermal noise in micromachined acoustic and vibration sensors. IEEE Trans Electron Devices, 1993, 40(5): 903
  • 4Gray P R, Meyer R G. Analysis and design of analog integrated circuits. 3rd ed: Wiley, 1977
  • 5Je C H, Lee M, Jung S, et al. Sensing gap reconfigurable capacitive type MEMS accelerometer. Proceedings of SPIE-The International Society for Optical Engineering, v6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 2008: 68001Z
  • 6Bao Minhang. Handbook of sensors and actuators series: micro mechanical transducer, vol.8. 1st ed. Elsevier, 2000:185
  • 7Petersen K E. Silicon as a mechanical material. Proc IEEE, 1982, 70:420
  • 8Bao Minhang. Handbook of sensors and actuators series: micro mechanical transducer, vol.8. 1st ed. Elsevier, 2000:232
  • 9Tag F E H, Xu J, Liang Y C, et al. The effects of non-parallel plates in a differential capacitive microaccelerometer. J Micromechani Microeng, 1999, 9(4): 283

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