塑封集成电路分层研究

Research on Delamination of Plastic Encapsulated Integrated Circuits

目前塑封集成电路的分层问题越来越受到半导体集成电路封装厂商以及整机厂商的关注和重视。文章对塑封集成电路的分层产生的机理和塑封表面贴装集成电路潮湿敏感度等级的认定作了介绍。另外,对几种主要的分层失效的标准作了详细解释和说明。文章对影响塑封表面贴装集成电路分层的主要因素进行了详细的分析和说明,并对三种不同封装形式塑封集成电路的吸湿和去湿过程进行了分析和研究,并给出了结论。最后文章就如何防止分层问题提出了相应的措施。

Currently more and more attention have been paid to delamination on Plastic Encapsulated Package, especially for plastic surface mount devices （SMDs）. In this paper, the mechanism of delamination induced on SMDs and classification of moisture sensitive level （MSL） are described. Further more, this paper also gives a detail explanation on major delamination criteria. The reasons which cause delamination on SMD have been analyzed. Absorption and desorption of plastic encapsulation package are also analyzed and conclusion was also provided. Finally, the preventive actions on how to prevent plastic encapsulated IC from delamination are addressed.