球焊金丝产生断裂的原因及改善加工性能的途径

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

对金丝生产中经常出现断头现象进行研究分析，通过扫描电子显微镜在内的检测技术提供三维影响立体图形，探讨微细金丝拉伸中产生断裂的原因，找出减少断头次数提高成材率的冶金因素及方法。

The fracture of gold wire are observed and analyzed with SEM technique, and the causes and appearances of fracture when it takes place during stretching are discussed Some ideas to improve the technology are put forword