期刊文献+

半固着磨具“陷阱”效应的颗粒流模拟 被引量:9

Particle Flow Simulation on the "Trap" Effect of Semi-fixed Abrasive Plate
下载PDF
导出
摘要 利用PFC软件建立了半固着磨具颗粒流模型,磨具中结合剂对磨粒的粘结作用由平行连接行为描述。模型参数通过半固着磨具试样的压缩比实验获得。考虑单颗大颗粒的"陷阱"效应,以量纲一的大颗粒陷入磨具的深度及对工件的法向载荷为指标,对半固着磨具的"陷阱"效应进行了仿真。讨论了磨具结合强度、加工载荷、大颗粒尺寸对"陷阱"效应的影响,发现磨具结合强度低、加工载荷大和大颗粒尺寸小将有利于"陷阱"效应的发挥。 A particle flow model of semi-fixed abrasive plate (SAP).was developed with PFC (particle flow code),in which the holding power of the bond to the abrasive grains was described by the parallel bond behavior. The parameters of the particle flow model were obtained by experimental tests of compression ratio of SAP samples. The "trap" effect of one large grain was simulated, and evaluated by tow dimensionless parameters of the falling depth of the large grain into the plate and the normal force of the large grain on the workpiece. The effects of bond strength, load, and the size of large grain were analyzed, and the results show that low bond strength, high load or small size of large grain tend to improve the "trap" effect.
出处 《中国机械工程》 EI CAS CSCD 北大核心 2009年第6期714-718,共5页 China Mechanical Engineering
基金 国家自然科学基金资助重点项目(50535040)
关键词 半固着磨具 “陷阱”效应 大颗粒 颗粒流方法 semi- fixed abrasive plate "trap" effect large grain particle flow method
  • 相关文献

参考文献13

  • 1Yasunaga N,Obara A, Tarumi N. Study of Mechanochemical Effect on Wear and Its Application to Surface Finishing[J]. Researches of the Electrotechnical Laboratory, 1977(776) : 50-134.
  • 2Ogita Y, Kobayashi K, Daio H. Photoconductivity Characterization of Silicon Wafer Mirror--polishing Subsurface Damage Related to Gate Oxide Integrity[J]. Journal of Crystal Growth, 2000,210 (1/3) : 36-39.
  • 3Basim G B, Adler J J, Mahajan U, et al. Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects [J]. Journal of The Electrochemical Society, 2000,147(9):3523-3528.
  • 4Zhong L, Yang J, Holland K, et al. A Static Model for Scratches Generated during Aluminum Chemical --mechanical Polishing Process:Orbital Technology [J]. Japanese Journal of Applied Physics, 1999,38 : 1932-1938.
  • 5Seo Y J, Kimb S Y, Choi Y O, et al. Effects of Slurry Filter Size on the Chemical Mechanical Polishing (CMP) Defect Density[J]. Materials Letters,2004, 58:2091-2095.
  • 6Basim G B, Moudgil B M. Effect of Soft Agglomerates on CMP Slurry Performance[J]. Journal of Colloid and Interface Science, 2002,256 : 137-142.
  • 7Ohmori H,Nakagawa T. Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electrolytic In--Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels[J]. Annals of the CIRP, 1995,44 (1) : 287-290.
  • 8Liu J H, Pei Z J, Fisher G R. Grinding Wheels for Manufacturing of Silicon Wafers:A Literature Review[J]. International Journal of Machine Tools and Manufacture, 2007,47 : 1-13.
  • 9Liu J H, Pei Z J, Fisher G R. ELID Grinding of Silicon Wafers: A Literature Review[J]. International Journal of Machine Tools and Manufacture, 2007, 47 : 529-536.
  • 10Yuan Julong, Lv Binghai, Wang Zhiwei. A Novel Semibonded Abrasive Plate for Finishing Advanced Ceramics[C]//The 6th International Conference on Manufacturing Research (ICMR08). London, 2008.

同被引文献56

  • 1魏昕,熊伟,黄蕊慰,袁慧.化学机械抛光中抛光垫的研究[J].金刚石与磨料磨具工程,2004,24(5):40-43. 被引量:20
  • 2杨守杰,戴圣龙.航空铝合金的发展回顾与展望[J].材料导报,2005,19(2):76-80. 被引量:206
  • 3张朝辉,杜永平,常秋英,雒建斌.化学机械抛光中抛光垫作用分析[J].北京交通大学学报,2007,31(1):18-21. 被引量:11
  • 4Yasunaga N, Obara A, Tarumi N. Study of Mecha- nochemical Effect on Wear and Its Application to Surface Finishing[J].Journal of JSPE, 1998,44 : 77- 83.
  • 5Basim G B, Adler J J, Mahajan U, et al. Effect of Particle Size of Chemical Mechanical Polishing Slur ries for Enhanced Polishing with Minimal Defects [J]. Journal of the Electrochemical Society, 2000,147(9):3523-3528.
  • 6Seo Y J, Kimb S Y, Choi Y O, et al. Effects of Slur ry Filter Size on the Chemical Mechanical Polishing (CMP) Defect Density[J]. Materials Letters,2004, 58(15) : 2091-2095.
  • 7Basim G B,Moudgil B M. Effect of Soft Agglomer ares on CMP Slurry Performance[J]. Journal of Colloid and Interface Science, 2002, 256 ( 1 ) : 137 - 142.
  • 8Ohmori H, Nakagawa T. Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electrolytic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels[J]. Annals of the CIRP,1995,44(1) :287-290.
  • 9Liu J H, Pei Z J, Fisher G R. Grinding Wheels for Manufacturing of Silicon Wafers: A Literature Review[J]. International Journal of Machine Tools and Manufacture, 2007,47 ( 1 ) : 1-13.
  • 10Liu J H,Pei Z J,Fisher G R. ELID Grinding of Silicon Wafers: A Literature Review[J].International Journal of Machine Tools and Manufacture, 2007,47 (3/4) :529- 536.

引证文献9

二级引证文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部