摘要
基于MEMS工艺技术,采用了单岛膜结构及其数学模型,设计并在4～6英寸（1英寸=2.54 cm）硅片上制作了汽车轮胎压力专用传感器IC芯片;并经过结构转化、参数指标拓展,以及测试条件改变,扩大芯片功能和应用范围,使得量程繁多、品种繁杂的芯片,转化为宽泛量程与功能兼顾的芯片,达到批量生产的目的。
On the basis of micro electric mechanical system （MEMS） technology, the single island film structure and mathematic model were adopted, the special automobile tire pressure sensor IC chip on a 4 to 6 inches＇silicon wafer was designed and developed. The scope of chip＇s function and application were broadened through structure transformation, extension of parameter indicators, and change of test conditions; which transfer complex range of varieties of chips to a broad range of functional chips, and the batch production was achieved.
出处
《仪表技术与传感器》
CSCD
北大核心
2009年第2期106-108,共3页
Instrument Technique and Sensor
基金
2005年度科技部创新基金资助项目(05C26211100004)
