MCM──多芯片组件

Multi Chip Module

针对电子系统中由传统的封装与互连工艺引起的互连信号延迟、串扰噪声、电感／电容耦合以及电磁辐射等问题，介绍一种新型的多芯片组装技术（ＭｕｌｔｉＣｈｉｐＭｏｄｕｌｅ）．

This article gives an introduction to technology of a new type multi chip module,which is expected to solve the problems of interlock signal delay,cross talk noise,inductance /capacitive coupling and electromagnetic radiation caused by the traditional sealing and interlock technology in electronic system