摘要
在电镀过程中影响镀层质量的因素很多,生产过程中不可避免地要出现一些质量上的问题,其中镀层与基体的结合强度就是衡量质量的重要指标之一。通过对镀层与基体结合机理及其影响因素的探讨,提出了提高镀层与基体结合强度的途径,为改善镀层的结合力提供了参考依据。
During electroplating, many factors affect electrodeposit quality, so quality problems are unavoidable in the production. The bonding strength between electrodeposit and substrate is just one of the important indicators in measuring product quality. Based on the exploration on the bonding mechanism between electrodeposit and substrate, ways to increase the bonding strength between electrodeposit and substrate are proposed.
出处
《电镀与环保》
CAS
CSCD
北大核心
2009年第2期7-9,共3页
Electroplating & Pollution Control
基金
国防基础科研(B0920061337)
关键词
电镀
结合强度
综述
electroplating
bonding strength
review
