摘要
研究了硫酸锌、添加剂和pH值对镀层沉积速率及镀层腐蚀电位的影响。测试了镀层在质量分数为3.5%的NaCl溶液中的Tafel曲线;用电化学阻抗实验对镀层的耐蚀性进行了测试。研究结果表明:镀层在质量分数为3.5%的NaCl溶液中,相对甘汞电极的腐蚀电势为-0.6009V,比化学镀Ni-P合金镀层的腐蚀电势-0.343V低258mV。
The electroless Ni-Zn-P alloy deposit was prepared from a sulphate bath. The effects of the process parameters (Zn2+ and additive concentration, pH) on the plating rate and coating corrosion potential were examined. Tafel plot of the deposit was tested in the mass fraction of 3.5 % sodium chloride solution. Corrosion resistance of the deposit was evaluated by electrochemical impedance methods. The results show that when in the mass fraction of 3.5 % Sodium chloride solution, the coating corrosion potential is --0. 600 9 V vs. SCE, 258 mV lower than the corrosion potential of electroless Ni-P alloy.
出处
《电镀与环保》
CAS
CSCD
北大核心
2009年第2期39-42,共4页
Electroplating & Pollution Control
关键词
化学镀
镍-锌-磷合金
沉积速率
耐蚀性
electroless plating
Ni-Zn-P alloy
plating rate
corrosion resistance