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超高速GaAs微波PIN二极管的研制及其性能分析 被引量:1

Manufacture and Performance Analysis of the Ultrafast GaAs Microwave PIN Diode
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摘要 论述了超高速GaAs微波PIN二极管的研制情况。从GaAs高阻外延生长着手,采用垂直台面结构,控制I层浓度为1013~1014/cm3,厚度为2.5~10μm。通过闭管Zn扩散形成P—N结,用Ti-Au及Au-Ge-Ni作上、下欧姆接触,研制出GaAs微波PIN二极管。通过测量其正向特性、容压特性、开关特性以及在典型开关电路中的应用,可以看出该器件在开关速度方面的性能尤其优越。 ? This article discusses the manufacture and performance of the ultrafast GaAs mic rowav e PIN diode. The diode was made from grown-high resistance-epitaxy and in vertic al mesa construction. The density of I layer was between 1013~1014/ cm 3 and thickness of I layer was between 2.5~10μm. Closed-tube Zn diffusion i s used to form P—N and Ti-Au, Au-Ge-Ni is as up-down ohmic contact. The GaAs microwave PIN diode has good performance in switching time by testing its forwa r d characteristics, capactive-voltage characteristics, switching characteristics and application in typical switching circuit. 【
作者 朱健 钱辉作
出处 《现代雷达》 CSCD 北大核心 1998年第2期59-62,共4页 Modern Radar
关键词 微波器件 PIN二极管 性能分析 砷化镓 】 microwave device and component, GaAs PIN diod e,performance analysis
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  • 1Burte E P and Wiget R.A comparison between fast power diodes fabricated on substrated made by silicon to silicon direct bonding and epitaxial substrates[C].In:Power Electronics and Drive Systems International Conference,1997(1):6-11.
  • 2Williams R and Jacques R.Evaluation of the yield impact of epitaxial defects on advanced semiconductor technologies[C].In:Semiconductor Manufacturing Conference Proceedings,1999 IEEE International Symposium,1999:107-110.
  • 3Yeh Ching-Fa,Hwang-Leu Shying and Jui-Tsai.The advanced improvement of PN mesa junction diodeprepared by silicon-wafer direct bonding[C].In:VLSI Technology Systems and Applications.Proceedings of Technical Papers,1991 International Symposium,1991:136-140.
  • 4Wiget R,Burte E P,Gyulai J,etc.Silicon to silicon direct bonding-characterization of the interface and manufacture of p-i-n diodes[C].In:Power Electronics and Applications,1993 Fifth European Conference,1993:63-68.
  • 5Faur M,F Maria,Chandra G,etc.Defect density reduction of n+p and p+n Inp structures fabricated by closed ampoule thermal diffusion[C].In:Indium Phosphide and Related Materials Fourth International Conference,1992:322-325.
  • 6Rosen A,Martinelli R U,Schwarzmann A,etc.High-power low-loss PIN diodes for phased-array rader[J].Rca Reiew,1979,3(40):22-58.
  • 7Cohen R M.Diffusion and native defects in GaAs[C].In:Optoelectronic and Microelectronic Materials and Devices Proceedings Conference,1996:107-113.
  • 8Li Z,Eremin V,Iiyashenko I,etc.Investigation of epitaxial silicon layers as a material for radiation hardened silicon detectors[J].Nuclear Science,IEEE Transactions,1998 45(3):585-590.
  • 9Wiget R,Pecz B and Burte E P.Silicon direct bonding(SDB) a substrate material for electronic devices[C].In:Power Electronics and Drive Systems,Proceedings of 1995 International Conference,1995:75-81.
  • 10Lasky J B.Wafer bonding for silicon-on-insulator technologies[J],Applied Physics Letters,1986(48):78.

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