纳米晶CuCr触头材料的制备及性能

PREPARATION AND PROPERTIES OF CuCr CONTACT MATERIALS WITH NANOMETER GRAINS

采用高能球磨Ｃｕ－Ｃｒ粉并在真空中缓慢热压的方法制备了纳米晶ＣｕＣｒ触头材料。实验结果表明，这种ＣｕＣｒ材料的晶粒尺寸为几十纳米，密度达到９０％，在真空间隙中的耐电压强度接近常规致密、低氧ＣｕＣｒ触头材料的水平。

The nanocrystalline CuCr contact materials were prepared in vacuum by heat-pressing Cu-Cr alloying powers made from high energy milling. Experimental results show that the average size of grain is about several decades nanometers and the relative density is in excess of 90% for this kind of CuCr materials. The dielectric strength in a vacuum gap approaches to the standard of ordinary CuCr contact materials.