摘要
用含二氮杂萘联苯结构的双马来酰亚胺(DHPZ-BM I)与4,4'-二氨基二苯砜(DDS)为复合固化剂固化环氧树脂(E-51)。采用示差扫描量热仪(DSC)研究了该体系的固化反应动力学,求得固化反应表观活化能Ea=63.28 kJ/mol,碰撞因子A=1.55×106s-1,反应级数n=0.89,该体系与链延长型双马来酰亚胺PPEK-BM I(DP=15)/DDS/E-51体系的固化反应动力学数据几乎相同,证明二者的固化反应过程相同。采用热失重分析仪(TGA)分析研究了上述2种固化体系的热分解动力学,前者的热分解活化能达215.04 kJ/mol,为后者的1.5倍以上,说明DHPZ-BM I/DDS/E-51是1种热稳定性能良好的耐高温环氧树脂体系。
The epoxy resin(E -51 )was cured with self- made bismaleimde containing phthalazinone (DHPZ- BMI)/DDS compound. The curing reaction kinetics of DHPZ - BMI/ DDS/ E - 51 was studied by DSC and the calculated results were as follows: apparent activation energy Ea = 63.28kJ/mol, frequency factor A = 1.55 × 10^6s^-1 and the curing reaction order n =0. 89. The results were almost as same as those of PPEK - BMI/DDS/E - 51 system and showed that the two system had the same curing reaction process. The thermal decomposition kinetics of the cured systems of DHPZ - BMI/ DDS/ E - 51 and PPEK - BMI/DDS/E - 51 were investigated by thermal gravimetric analysis (TGA). The thermal decomposition energy of the former was 215.04 kJ/mol and 1.5 times than that of the later system. It showed that DHPZ - BMI/ DDS/ E - 51 was a heat - resistant epoxy system with good thermal stabilities.
出处
《热固性树脂》
CAS
CSCD
北大核心
2009年第2期10-13,22,共5页
Thermosetting Resin