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双烯丙基双酚A改性内扩链双马来酰亚胺研究 被引量:5

Study on modification of maleimide-terminated polyimide oligomers with diallybisphenol A
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摘要 采用自制的叔丁基二胺单体1,4-双(4-氨基苯氧基)-2-叔丁基苯(BATB)与双酚A二酐(BPADA)反应,并以马来酸酐作为封端剂得到了一系列链中含酰亚胺环的内扩链双马来酰亚胺,将所得双马来酰亚胺混合双烯丙基双酚A(BBA)制得无胶型挠性覆铜板。采用傅里叶变换红外光谱(FTIR)、核磁共振氢谱(1H-NMR)、凝胶渗透色谱(GPC)、示差扫描量热法(DSC)和热重分析(TGA)对合成的封端聚酰亚胺树脂的结构进行了表征并测试了其性能,研究了BBA用量及加入前后对封端聚酰亚胺基膜力学性能、热性能、聚酰亚胺树脂固化性能的影响。结果表明,BBA与封端聚酰亚胺物质的量比为1∶1时,其增韧改性效果最佳。加入BBA后的薄膜在不降低热性能的情况下,力学性能提高(拉伸强度可达到67.14 MPa,弹性模量达到1 449.73 MPa,断裂伸长率最大达到6.17%)。所得两层型挠性覆铜板具有优异的耐热性、尺寸稳定性、低吸水率。 A series of maleimide - terminated polyimide oligomers were synthesized from the reaction of self - made tert- butyl diamine 1, 4- his(4- aminophenoxy) -2- tert- butylbenzene(BATB) and bisphenol A dianhydride (2, 2 L his [ 4 - ( 3, 4 - dicarboxyphenoxy) phenyl ] propane dianhydride (BPADA) using maleic anhydride as blocking agent. The adhesiveless flexible copper clad laminate was obtained by mixing the products with diallybisphenol A. The stuctures and properties of the maleimide - terminated polyimides and the effect of BBA amount, before and after adding on the mechanical and thermal properties of maleimide - terminated polyimide film and curing properties of polyimide resin were investigated by FTIR, ^1H-NMR, GPC, DSC and TGA analysis. The results shows that the toughening modification effect was best with the molar ratio of BPA to maleimide - terminated polyimide 1 : 1. The mechanicl properties of matrix was improved without decresing heat resistance. The tensile strength, elastic modulus and elongation at break was up to 67.14 MPa, 1 449.73 MPa and 6. 17% respectvely. The 2L - FCCL had excellent heat resistance, thermal dimensional stability and low water - absorption.
出处 《热固性树脂》 CAS CSCD 北大核心 2009年第2期14-18,共5页 Thermosetting Resin
关键词 双马来酰亚胺 马来酸酐封端 双烯丙基双酚A 改性 无胶型挠性覆铜板 bismaleimides maleic anhydride - terminated diallybisphenol A modification free - adhesives FCCL
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参考文献6

  • 1Mison P, Sillion B. Thermosetting oligomers containing maleimides and nadimides end -groups[ J ]. Advances in Polymer Science Progress in Polyimide Chemistry I, 1999, 140(135 ):137-179.
  • 2Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, et al. Thermoplastic resin composition having low permittivity, prepreg laminated plate and laminated material for circuit using the same US, 6492030[ P]. 2002 - 11 - 10.
  • 3Shur Fen Liu, Mcng Huci Chcn, Jinn - Shing King, et al. Resin composition for circuit boards: US, 20030144430[ P]. 2003 -07 -31.
  • 4Jone A, Mikroyannidis, Anastasios P, et al. High temperature laminating resins based on maleimide end -capped pyromellitimide[ J ]. Journal of Applied Polymer Science, 1988, 36:691 - 702.
  • 5Andrea E Hoyt, Samuel Huang. Reactive lyotropie polyimide oligomers[ J ]. Journal of Polymer Science : Part A : Polymer Chemistry, 1996, 34:587-595.
  • 6Feng Liu, Zhen Wang, Huili Yang, et al. Synthesis of novel maleimide- terminated thioetherimide oligomer and its bulk copolymerization with reactive solvents polymer[ J]. Polymer, 2006, 47 ( 3 ) : 937 - 945.

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