抗坏血酸在离子液体[BMIM]PF_6修饰电极上的直接电化学

Direct Electrochemistry of Ascorbic Acid on the [BMIM]PF_6 Modified Carbon Paste Electrode

以室温离子液体1-丁基-3-甲基咪唑六氟磷酸盐([BMIM]PF6)代替传统液体石蜡为粘合剂与石墨粉相混合制备了一种新型离子液体修饰碳糊电极(IL-CPE)。以制备的离子液体修饰碳糊电极(IL-CPE)为工作电极,将其应用于抗坏血酸的直接电化学行为研究。实验结果表明,抗坏血酸在离子液体修饰电极上表现出较好的电化学行为,与传统碳糊电极(CPE)相比,过电位降低165 mV,峰电流增加2.4倍。

A room temperature ionic liquid 1-butyl-3-methyl imidazolium hexafluorophate（PF6） was used as a binder to make an ionic liquid modified carbon paste electrode（IL-CPE）.The direct electrochemistry of ascorbic acid（AA） on the new IL-CPE was carefully studied.The result indicated that AA had good electrochemical behaviors on the IL-CPE.The oxidation peak potential of AA on the IL-CPE decreased for 165 mV compared with that obtained on traditional carbon paste electrode（CPE） and the oxidation peak current was increased for about 2.4 times.