摘要
配制了w(Ce)为0.1%和不加Ce的两种Sn-3.5Ag-0.7Cu焊料。在443K恒温时效,研究Ce对焊料与铜基板界面金属间化合物(IMC)的形成与生长行为的影响。结果发现,焊点最初形成的界面IMC为Cu6Sn5,时效5d后,两种焊料界面均发现有Cu3Sn形成。随着时效时间的增加,界面化合物的厚度也不断增加。焊料中添加w为0.1%的Ce后,能抑制等温时效过程中界面IMC的形成与生长,生长速率降低近1/2。并且,界面IMC的形成与生长均由扩散机制控制。
Two Sn-3.5Ag-0.7Cu solders with adding w（Ce） of 0.1% and no Ce were mixed. The influence of between adding micro Ce and no Ce in Sn-3.5Ag-0.7Cu solders and Cu-substrate during isothermal aging at 443 K on interface IMC formation and growth behaviour was studied. Results show that the initial forming interface IMC of the soldering joint is Cu6Sn5, for Cu3Sn to form is observed in both solder interfaces after aging 5 days. Interface IMC thickness increases with aging time increment. Adding w（Ce） 0.1% in Sn-3.5Ag-0.7Cu solder can suppress interface IMC formation and growth, the growth rate decreases about 1/2. And both of interface IMC formation and growth are controlled by diffusion mechanism.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第4期40-42,46,共4页
Electronic Components And Materials
