摘要
提出了实现具有温度传感功能的RFID无源标签芯片电路的设计思路,结合900MHz超高频EPC Class0协议,提出电子标签结构及参考电路,包括射频前端接收电路、数字逻辑控制部分、温度传感及量化和存储器四部分组成。采用Chartered0.35μm CMOS工艺流片、测试。温度量化采用一个低功耗8位逐次逼近模数转化器实现,输出温度量化误差在0~90℃范围内为±2℃。芯片测试工作电流20.7μA(不包含存储器)。
A passive tag with temperature sensor in 0.35 /μm CMOS process has been presented. The design follows the EPC Class0 protocol and includes the RF front-end circuit, digital logical circuit, temperature sensor and memory circuit. The design is implemented and tested by using the library of Chartered 0. 35μm CMOS process. A low-power 8 bit successive approximation analog to digital converter (ADC) is used to quantize the temperature output. The error of the temperature quantity output is ±2℃ in the range of 0~90℃. Without ROM included, the whole current dissipation is 20.7 μA.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2009年第1期147-151,共5页
Research & Progress of SSE