摘要
文章讨论了PCB化金生产制作工艺遇到的相关问题,指出影响PCB化金生产稳定性的各种因素和解决方案,从实践的角度探讨了稳定化金工艺的管理手段和途径。
This article discusses the question of the Electroless Nickel/Immersion Gold technics,point out effect equation and untie scheme about the PCB production of the Electroless Nickel/Immersion Gold,discuss level off the Electroless Nickel/Immersion Gold technics from manage artifice and approach into practice point of view.
出处
《印制电路信息》
2009年第4期43-45,52,共4页
Printed Circuit Information
关键词
化金工艺
稳定性
管理
维护
the electroless nickel/immersion gold technics
stability
manage
maintenance