主链含有机硅结构单元的光敏聚酰亚胺的研究

Studies on Photosensitive Polymide with Organo-Silicone Moiety in Main Chain

提出了一类主链上含有机硅结构单元的光敏聚酰亚胺（ＰＳＰＩ）。其合成过程是首先制备聚酰胺酸预聚体，接着在二环己基碳二酰亚胺存在下，使之转变为聚硅氧酰亚胺，然后引入光敏基团。通过ＩＲ、ＤＳＣ、元素分析、ＵＶ、介电分析方法对聚酰亚胺的结构、感光特性、热性能、电性能、粘附性、吸湿性能等进行了表征。对结构与性能之间的关系进行了初步探讨。

This paper describes the preparation of a kind of photosensitive polyimides(PSPIs) which contain organo-silicone moiety chain in main chain . The PSPIs were synthesized by adding the photosensitive monomer(eg. HEA) to polysiloxaneisoimides, which were prepared by the polyamic acid with dicyclohexylcarbodiimide(DDC). The properties and structure of PSPIs, such as UV absorption, thermal properties, electric and adhesion properties, and moisture absorption, were characterized by UV, DSC,TMA, dielectric constant detector and so on. The relationship between structure and properties of PSPIs were discussed.