EoS系统中GFP封装与解封装的设计

Design of GFP encapsulation and de-encapsulation in EoS system

根据协议ITU-T G.7041/Y.1303的规定,对EoS系统中GFP封装与解封装电路及电路子模块进行了设计,并根据实际要求,通过在Xilinx公司VirtexII Pro系列XC2VP40器件上的实现,得到了最终实现结果。结果表明,设计符合高速EoS系统的应用。

According to ITU-T G.7041/Y. 1303, the paper completed design of GFP encapsulation and de-encapsulation circuits and sub modules. According to actual needs, the implementation result is present for the implementation on Xilinx＇s XC2VP40 of VirtexlI Pro series. The result shows that the design is suitable for high speed application in EoS system.The focuses on the design of GFP encapsulation and de-encapsulation in EoS system.