摘要
对国内外无铅钎料的研究与应用进行了综述,主要介绍了国内外研究者通过添加各种微量元素(特别是Ga,In,Ti,Mn,Co,Al以及各种稀土元素等)改善与提高无铅钎料的物理性能、钎焊性能的研究成果,同时简述了微量元素对无铅钎料显微组织的影响、无铅钎料在应用过程中出现的新问题以及解决方法,并对国内未来无铅钎料的发展趋势进行了分析与展望。
The current situation was summarized on the study,development and application of lead-free solders at home and abroad and the physical properties,solder ability and their microstructures of new lead-free solders bearing micro alloying elements,such as Ga,In,Ti,Mn, Co,Al,rare earths,etc.,have been commended respectively.The problems and difficulty in the process of the applications of lead-free solders in electronics industry were analyzed synchronously,some suggestions have been put forward which maybe solve those problems and difficulty as mentioned above,and the prospect on lead-free solders was analyzed and looked ahead.
出处
《焊接》
北大核心
2009年第3期24-33,共10页
Welding & Joining
基金
2006年江苏省"六大人才高峰"资助项目(06-E-020)
