高密度系统级封装中的纳米材料和技术

Nanomaterials and Nanotechnologies in the High Density System Level Packages

纳米材料和纳米技术在新型电子封装技术中发挥着越来越重要的作用,纳米材料及其复合材料在电、磁、光等方面的优越性可以提高和改善元器件的物理、机械性能。本文介绍和评价了目前电子封装技术中出现的同封装材料密切相关的各类问题以及纳米材料、纳米复合材料和纳米技术等在解决这些问题方面的优势及发展方向,并着重介绍了纳米金属导电颗粒、二氧化硅、碳纳米管、石墨烯等新材料在高密度系统级封装中的应用。

Nanomaterials and nanotechnology play more and more important role in the field of new generation electronics packaging.The unique electrical,magnetic and optical properties of the nanomaterials along with their composites can enhance and improve the physical and mechanical properties of the components.Current issues of electronic packaging,especially those related to materials,are introduced and evaluated in this review.The nanomaterials,nanocomposites and nanotechnology have advantages in solving these issues and their future development direction.This review also focuses on the application of new materials such as,conductive metal particles,silica,carbon nanotubes,graphene,etc.in the high density system level packages.