摘要
本文介绍无氰沉金工艺特性,主要特性是无氰沉金金面均匀性高及其可减少黑盘(pad)的产生机率、更环保。替代传统的沉金工艺有着显著的优势。随着PCB生产技术成熟、环保的要求不断提升,工艺市场潜力将非常大。此项工艺的也符合环保要求,所以倍受PCB同行的关注。
This article describes the characteristics of Cyanide-Free Immersion Gold process, which has high uniformity and reduce probability of black-PAD. And compared with the traditional immersion gold, this process has very big advantage. With PCB manufacturing technology and environmental requirements rising, this process will have very large market . This process meet environmental requirement. So we must pay attention to it.
出处
《印制电路信息》
2010年第S1期1-8,共8页
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