红外光谱检测阻焊油墨固化程度试验报告

Measuring solidifying extent of solder mask by FTIR spectrum test report

为从本质上分析阻焊剂剥离的原因,即光固化成分和热固化成分含量的差异,开展此试验。通过采用红外光谱检测阻焊油墨中环氧基以及丙烯基的含量,以衡量油墨的固化程度。并以此分析生产流程各环节对油墨固化程度的影响。通过研究不同的固化成分对阻焊剂结合力的影响,在业界开创了一种新的量化方法。

Take up this experimentation to analyse essential cause, the difference of content of light solidifying and heat solidifying, of solder mask peeling off. Scale solidifying extent of solder mask by measuring the content of epoxy and propenyl of solder mask by FTIR spectrum. And then analyse how each approach of production process affects solidifying extent of solder mask. Create a new scale method through research on affection of different solidifying component to binding force of solder mask.