浅析化镍金焊接后黑垫产生原因

Analyzing the Reason of black PAD after ENIG soldering

化学沉镍金是一种能满足大多数的组装要求的可行的表面涂层,不仅具备抗氧化功能,并有平整的PAD表面,在电子\通讯领域有十分广泛之用途,但化镍金焊接后存在黑垫问题一直困扰PCB制造商、药水供应商以及下游SMT客户,目前PCB业界对化镍金焊接后黑垫产生原因比较模糊未有明确定义,本文将通过试验对比对化镍金板焊接后出现黑垫产生原因进行分析及探讨。

ENIG(electroless nickel immersion gold) is a surface treatment which can satisfy most of the assembly of the PCB and which has not only the function of resisting the oxide but also has the function to level the PAD surface. So it is widely used in the area of electronics and communication. But the problem of the black PAD after ENIG soldering is always bothering the PCB manufacturer ,the supplier of the chemicals and the SMT customers In recent the reason is still not very clear and does not have precise definition And it will be analyzed and discussed in this article through experiment to show the reason of black PAD.