摘要
超等角沉积在电镀填充盲孔过程中扮演重要角色,其主要通过添加剂作用加速盲孔底部并抑制面铜及孔口电沉积速度,形成超等角沉积模式以最终达到盲孔填充。本文通过与生产制程相结合,对电镀填孔过程中影响超等角沉积的因素进行探讨,主要包括形成超等角沉积过程中添加剂作用机理、盲孔厚径比、孔型以及喷流量等影响因素。
Super filling is play an important role for Microvia filling by electroplating .The additive can accelerate the electrical deposition rate of the blind hole bottom, also inhibit the electrical deposition rate of the surface and the corner of blind hole, it can form a bottom up deposition model and finally the microvia filling was formation. The factor that influenced the super-filling deposition was discussed by combined with manufacture.
出处
《印制电路信息》
2010年第S1期92-97,共6页
Printed Circuit Information
关键词
超等角沉积
电镀填孔
盲孔
Super Filling
Microvia filling
blind via
