电镀铜厚差异对线宽的影响大小

The impact of plating copper thickness difference on line width

本文针对电镀不均造成精细线路制作困难的问题,试验分析了不同电镀铜厚、不同最小间距板的线宽过蚀量,推算确定了不同电镀铜厚差异下的线宽大小差异值;并能根据线宽差异值反推出电镀铜厚差异的控制范围,为相关的生产指导和品质判定提供有价值、方便快捷的方法。

This article aimed at the problem that fine line etching is difficult because of the difference of plating copper thickness. Through some trials of different plating copper thickness and different line spaces , the difference of line width with different plating copper thickness has been calculated and analyzed. And the control range of plating copper thickness has been gained. The article offers the means to direct manufacture and determinant quality more quickly and effectively.