HDI刚挠结合板微埋盲孔研究进展

Research on the process of Micro buried/blind Via in HDI rigid-flex PCB

随着电子产品的小型化、轻量化、薄型化的发展,PCB更多的开始选用微埋盲孔结构。本文概述了国内外HDI刚挠结合板微埋盲孔制作的最新研究成果,主要包括微埋盲孔钻孔工艺、去钻污工艺以及孔金属化研究等。重点介绍了激光钻孔技术、微孔填铜技术的发展及应用,并提出了今后的研究方向。

As the electronic products becoming smaller,lighter,thinner,more and more PCB manufacturer would like to choice micro buried/blind via structure.The latest research on this process of HDI Rigid-Flex PCB in and out of china was reported in this paper.Including the micro via drill process,via cleaning process and hole metallization technology.The use and development of laser drill technology and micro via copper filling process were the main point,and the future research directions were suggested.